PEIR-Plan-20x

High-resolution objectives for near infrared wavelengths up to 1600nm. Applications include laser marking, laser cutting and photo emission detection. LCD and Silicon thickness corrected versions available.

Image Circle (mm):
24
Magnification:
20x
Working Distance:
12
Focal Length (mm):
10
N.A.:
0.5
RP (μm):
1.3
DOF (μm):
2.2
Weight (g):
430

High-resolution objectives for near infrared wavelengths up to 1600nm. Applications include laser marking, laser cutting and photo emission detection. LCD and Silicon thickness corrected versions available.

Image Circle (mm):
24
Magnification:
20x
Working Distance:
12
Focal Length (mm):
10
N.A.:
0.5
RP (μm):
1.3
DOF (μm):
2.2
Weight (g):
430

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