PEIR-Plan-2.5x

High-resolution objectives for near infrared wavelengths up to 1600nm. Applications include laser marking, laser cutting and photo emission detection. LCD and Silicon thickness corrected versions available.

Image Circle (mm):
24
Magnification:
2.5x
Working Distance:
28
Focal Length (mm):
80
N.A.:
0.1
RP (μm):
6.7
DOF (μm):
55
Weight (g):
300

High-resolution objectives for near infrared wavelengths up to 1600nm. Applications include laser marking, laser cutting and photo emission detection. LCD and Silicon thickness corrected versions available.

Image Circle (mm):
24
Magnification:
2.5x
Working Distance:
28
Focal Length (mm):
80
N.A.:
0.1
RP (μm):
6.7
DOF (μm):
55
Weight (g):
300

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