PEIR-Plan-1x

High-resolution objectives for near infrared wavelengths up to 1600nm. Applications include laser marking, laser cutting and photo emission detection. LCD and Silicon thickness corrected versions available.

Image Circle (mm):
24
Magnification:
1x
Working Distance:
12
Focal Length (mm):
200
N.A.:
0.03
RP (μm):
22.4
DOF (μm):
611
Weight (g):
420

High-resolution objectives for near infrared wavelengths up to 1600nm. Applications include laser marking, laser cutting and photo emission detection. LCD and Silicon thickness corrected versions available.

Image Circle (mm):
24
Magnification:
1x
Working Distance:
12
Focal Length (mm):
200
N.A.:
0.03
RP (μm):
22.4
DOF (μm):
611
Weight (g):
420

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